廣東UHP-0805MC,USP-1515M4批發，玻璃切割uv膜
產品價格：￥電詢（人民幣）
商鋪名稱：東莞市新友維膠粘制品有限公司
聯系人：王桂云（小姐）
聯系手機：
固定電話：
企業郵箱：1779529894@qq.com
聯系地址：東莞市長安鎮咸西新工業區富寧街9號
郵編：523861
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商品詳情
晶圓切割膠帶- Pressure Sensitive Series -
Part Number :
F - 90
T - 80
T - 120
GE - 200
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
Feature
● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability
Specification
Recommended Works Part Number Base
Film Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
Si
GaAs
Other Semiconductor F-90MW PO MW 90 10 1 1 PVC-free type
T-80MW PVC 80 0.8 0.7 Excellent temporal stability
T-80HW 1.7 1
T-120HW 120 1.7 1
Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.
晶圓切割膠帶- UV Series -
Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
Feature
● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.
Recommended
Work I Si
GaAs
Other Semi conductor
Part Number UDV-
80J
UDV-
100J
UHP-
110B
UHP-
0805MC
UHP-
1005M3
UHP-
110M3
基材 PVC PO
顏色 T MW
總厚度 (μm) 80
100
110
85
105
110
黏著力 (μm) 10 5 10
Adhesive Strength (N/20mm) 3.8(0.2)
3.8(0.2)
2.9(0.2)
5.0(0.2)
5.0(0.2)
7.6(0.2)
Probe Tack (N/20mm2) 2.1(0.05)
2.1(0.05)
2.7(0.05)
1.7(0.05)
2.7(0.05)
3.9(0.05)
特性 Easy pickup For less chipping For small size chips
Recommended
Work II Package
Part Number UHP-1025M3
UHP-1510M3
UHP-1525M3
USP-1515M4
USP-1515MG
基材 PO
顏色 MW
總厚度 (μm) 125
160
175
165
黏著力 (μm) 25
10
25
15
Adhesive Strength (N/20mm) 12.0(0.2)
6.5(0.2)
13.5(0.2)
14.5(0.2)
15.0(0.2)
Probe Tack (N/20mm2) 5.5(0.05)
4.2(0.05)
5.6(0.05)
6.2(0.05)
5.9(0.05)
特性 For encapsulated workpiece
For less backside burrs
For less glue scratch-up on the chip side walls
For less against residue onto a making area
Recommended
Work III Glass
Crystal
Part Number UDT-1025MC
UDT-1325D
UDT-1915MC
基材 PET
顏色 T
總厚度 (μm) 125
155
203
黏著力 (μm) 25 15
Adhesive Strength (N/20mm) 30.0(0.2)
20.4(0.2)
20.3(0.2)
Probe Tack (N/20mm2) 7.5(0.05)
6.7(0.05)
5.9(0.05)
特性 For less backside cracking
For encapsulated workpiece
For less backside cracking
＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.
Part Number :
F - 90
T - 80
T - 120
GE - 200
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
Feature
● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability
Specification
Recommended Works Part Number Base
Film Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
Si
GaAs
Other Semiconductor F-90MW PO MW 90 10 1 1 PVC-free type
T-80MW PVC 80 0.8 0.7 Excellent temporal stability
T-80HW 1.7 1
T-120HW 120 1.7 1
Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.
晶圓切割膠帶- UV Series -
Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
Feature
● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.
Recommended
Work I Si
GaAs
Other Semi conductor
Part Number UDV-
80J
UDV-
100J
UHP-
110B
UHP-
0805MC
UHP-
1005M3
UHP-
110M3
基材 PVC PO
顏色 T MW
總厚度 (μm) 80
100
110
85
105
110
黏著力 (μm) 10 5 10
Adhesive Strength (N/20mm) 3.8(0.2)
3.8(0.2)
2.9(0.2)
5.0(0.2)
5.0(0.2)
7.6(0.2)
Probe Tack (N/20mm2) 2.1(0.05)
2.1(0.05)
2.7(0.05)
1.7(0.05)
2.7(0.05)
3.9(0.05)
特性 Easy pickup For less chipping For small size chips
Recommended
Work II Package
Part Number UHP-1025M3
UHP-1510M3
UHP-1525M3
USP-1515M4
USP-1515MG
基材 PO
顏色 MW
總厚度 (μm) 125
160
175
165
黏著力 (μm) 25
10
25
15
Adhesive Strength (N/20mm) 12.0(0.2)
6.5(0.2)
13.5(0.2)
14.5(0.2)
15.0(0.2)
Probe Tack (N/20mm2) 5.5(0.05)
4.2(0.05)
5.6(0.05)
6.2(0.05)
5.9(0.05)
特性 For encapsulated workpiece
For less backside burrs
For less glue scratch-up on the chip side walls
For less against residue onto a making area
Recommended
Work III Glass
Crystal
Part Number UDT-1025MC
UDT-1325D
UDT-1915MC
基材 PET
顏色 T
總厚度 (μm) 125
155
203
黏著力 (μm) 25 15
Adhesive Strength (N/20mm) 30.0(0.2)
20.4(0.2)
20.3(0.2)
Probe Tack (N/20mm2) 7.5(0.05)
6.7(0.05)
5.9(0.05)
特性 For less backside cracking
For encapsulated workpiece
For less backside cracking
＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.
